FPC Prototype in Humanized Way

Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Quick FPC Prototype
Quick FPC Prototype | FPCway
Flex PCB Production
Flex PCB Production | FPCway
Rigid-Flex PCB Prototype
Rigid-Flex PCB Prototype | FPCway
Flex PCB Assembly
Flex PCB Assembly | FPCway
Rigid-Flex PCB Assembly
Rigid-flex PCB Assembly | FPCway
Rigid PCB and Assembly
Rigid PCB and Assembly | FPCway
Electronic PCBA Design
Electronic PCBA Design | FPCway
Components Sourcing
Components Sourcing | FPCway
SMD Stencil
SMD Stencil | FPCway

We are specialized in the quick FPC prototype for 1-16L flex PCB boards. Our advanced flex PCB technical capabilities allow us to develop and produce a top-performing flex PCB that meets your unique requirements.

 

And our Flex PCB boards now are highly used in computer, communication network equipment, mobile phone, digital camera, instrumentation, aerospace instrument, biomedical, home appliance and lighting, drone, smart wear, smart home, bluetooth, car, industrial control, robot, tablet, LCD, projection Instrument, car navigation, security and other high-tech fields, etc. 

 

Lead Time for Flex PCB

Layer Standard FPC Specification

Quickest Protype

 Standard Prototype

Production Time

1L

1Layer, PI, 0.05mm-0.2mm thickness, 6um-100um base copper, Yellow Coverlay, White silkscreen, ENIG

1-2 Days5-7 Days8-10 Days

2L

2Layer, PI, 0.08mm-0.3mm thickness, 6um-100um base copper, Yellow Coverlay, White silkscreen, ENIG

1-2 Days5-7 Days8-10 Days

4L

4Layer, PI, 0.2mm-0.4mm thickness, 6um-100um base copper, Yellow Coverlay, White silkscreen, ENIG

3-4 Days8-10 Days10-12 Days

6L-16L

Up to the customers requirements.

6-8 Days12-14 Days14-18 Days

 

FPC has single sided FPC, double sided FPC, multi-layer FPC and Rigid-flex PCB. The main substrate is polymide FCCL and it has high heat resistance and stable size. Following are the common layer structure and stack up for Flex PCB for your reference. The FPC final thickness could be adjusted flexibly with different thicknesses of PI, adhesive, copper, etc.

 

FCCL Material Thickness
Coverlay/Solder Mask 2Layer FCCL
 PI (12.5/25/50/100um, etc.) Copper (6/9/12/18/35/70/100um, etc.)
 AD (15/25/35/50um, etc.) AD (0/12.5/20/25um, etc.)
  PI (12.5/25/50/100um, etc.)
1Layer FCCL AD (0/12.5/20/25um, etc.)
 Copper (6/9/12/18/35/70/100um, etc.) Copper (6/9/12/18/35/70/100um, etc.)
 AD (0/12.5/20/25um, etc.) 
 PI (12.5/25/50/100um, etc.)

 

Flex PCB Stack-up Structure

 

 

Flex PCB Technical Capabilities

FPC Layer

NO.ITEMStandard CapabilitiesSpecial Capabilities
1FPC Layer1-12L1-16L

FPC Material

2Base MaterialPI (12.5um, 25um, 50um)100um
3Copper TypeRA Copper: 12um, 18um, 35um, 70um

ED Copper: 12um, 18um, 35um, 70um
6um, 9um, 100um
4PI Coverlay12.5um, 25um, 50um100um
5AdhesivePSA Adhesive: 50um-100um (3M467, Tesa 8853, Tesa 8854, etc.) 
6Hot-Press Adhesive: 13um, 25um 
7StiffenersPI Stiffener: 12.5/25/50/75/100/125/150/200/250 (um) 
PET Stiffener: 0.125/0.188/0.25(mm) 
FR4 Stiffener: 0.1mm-1.6mm2mm
SUS Stiffener: 0.1mm-0.5mm 
Aluminum Stiffener: 0.1mm-0.5mm 
8EMI shielding filmHCF-6000G, PC800, etc.100um

Board Size & Thickness

9Biggest Board Size500mm*600mm 
10Longest Board Size250mm*2520mm 
11Biggest Board Thickness2.0mm 
12Thinnest Board Thickness0.05mm 
13Thickness Tolerance0.05mm~0.24mm: ±0.03mm
0.25mm~0.47mm: ±0.05mm
 

Drill

14Minimum Hole Size0.1 mm0.025mm
15Holes Size Tolerance±0.05 mm 
16Holes Posistion Tolerance±0.05 mm 
17Minimum vias Pad Size0.3mm0.2mm
18Minimum Annular Ring Size0.1mm0.075mm
19Blind/Buried ViasYes 

Copper Tracks and Plating

20Minimum Track Width/Space (35um Copper)0.1mm/0.1mm 
21Minimum Track Width/Space (18um Copper)0.07mm/0.07mm0.05mm/0.05mm
22Minimum Track Width/Space (12um Copper)0.04mm/0.04mm0.035mm/0.035mm
23Track Width Tolerance20%0.02mm
24Tracks/Pads Position Tolerance≥0.06 mm≥0.05 mm
25Tracks/Pads To Board Edge≥0.15 mm≥0.05 mm
26Golden Finger Pitch TolerancePitch:10~20mm : ± 0.03mm,
Pitch:20~50mm : ± 0.05mm
 
27Copper Plating Thickness8-20um 
28Hole Copper Thickness8-20um35um
29Minimum Copper Thickness for Hollow Out FPC35um 

Surface Finish

30ENIGAU: 1-2u" Thickness
NI: 40-120u" Thickness
 3u” Thickness
31Electrolytic Nickel Gold
(Hard Gold Plating)
AU: 1-50u” Thickness
NI: 80-320u" Thickness
 
32Immersion Silver Ag: 6-12u" Thickness 
33OSP 8-16u" Thickness 
34Immersion Tin SN: 10-60u" Thickness 
35Tin Plating SN: 5-30um Thickness 
36ENEPIGAu:1-4u" Thickness
NI: 120-200u" Thickness
Pd:1-6u" Thickness
 

Coverlay

37Coverlay Opening Size Tolerance±0.1 mm±0.03 mm
38Minimum Drilling Size on Coverlay Opening0.45mm0.2mm
39Minimum Square Size on Coverlay Opening0.7mm*0.7mm0.2mm*0.2mm
40Coverlay Opening Position Tolerance±0.1 mm±0.03 mm
41Coverlay Align Tolerance±0.1 mm±0.02 mm
42Excessive Glue≤0.15 mm 
43Minimum Area of Excessive Glue≤20% Pads Area 

Solder Mask and Silkscreen

44Solder Mask Thickness15um +/-5um 
45Solder Mask Tolerance For Opening Size+/-0.05mm+/-0.02mm
46Solder Mask Tolerance For Opening Position0.1mm+/-0.02mm
47Minimum Silkscreen line width0.13mm 
48Minimum Silkscreen Gap0.2mm 
49Minimum Silkscreen Position Tolerance+/-0.3mm 
50Minimum Silkscreen height0.8mm 
51Minimum Solder Mask Bridge0.13mm 

Board Outline & Stiffeners

52Board Outline Tolerance
with Steel Die
±0.1 mm±0.03mm 
53Board Outline Tolerance
with Knife Die
±0.2 mm 
54Minimum Gap Between Drilling and Board Edge≥0.5 mm 
55PSA Position Tolerance±0.2 mm 
56Stiffeners Position Tolerance±0.2 mm 

FPC E-Test

57Test Voltage10-50V 
58Insulation Test Impedance≥10MΩ 
59Conduction Test Impedance≤50Ω 
60Impedance Tolerance10% 

FPC Physical Property

61Solderability Test245±5℃, 3 Seconds For One Time,
Soldering Area≥95% 
 
62Thermal Shock Test288±5℃, 10 Seconds Per 3 Times,
No Delamination and No Bubbles
 
63FCCL Peel Strength≥0.8kgf/㎠  (1cm width sample) 
64Coverlay Peel Strength≥0.8kgf/㎠  (1cm width sample) 
65Stiffeners Peel Strength 0.15 N/mm (Hot-Press Adhesive)
0.49 N/mm (PSA Adhesive)
 

 

Contact us

  • Email: sales@fpcway.com
  • Tel: 086 18576671093
  • Skype: Downey_PCB-PCBA
  • Address: No.12, Shapuwei Industrial Road
  • Songgang Street, Baoan District, Shenzhen

About us

  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
  • Flex PCB compliant ISO9001, ISO14001, TS16949, UL, RoHS.
    PCB Assembly compliant ISO9001, IATF16949, IPC-A-610E.
  • Our aim is "Humanized way to make Flex PCB". Choose us,
    you will have the best flex PCB and assembly partner.

Certifications

© 2023-2033 FPCWAY All Rights Reserved